TESCAN SEM (MIRA)
TESCAN MIRA
High performance field emission scanning electron microscope
The TESCAN MIRA is the latest fourth generation high performance scanning electron microscope with a high brightness Schottky field emission electron gun that enables SEM imaging and real-time elemental analysis in the same window of TESCAN’s Essence™ operating software. This combination greatly simplifies the process of obtaining topographical and elemental data from a sample, making MIRA an effective analytical solution for quality control, failure analysis, and routine materials testing in the laboratory.
Modern Electron Optics
- High brightness Schottky emitter for high-resolution/high current/low-noise imaging
- Unique Wide Field Optics™ design with a proprietary Intermediate Lens (IML) offering a variety of working and displaying modes, for enhanced field of view or depth of focus, etc.
- Real-time In-Flight Beam Tracing™ for performance and beam optimization, which also allows direct and continuous control of the beam and beam current
- Beam Deceleration Technology (BDT) for excellent resolution at low electron-beam energies
- Excellent imaging at short working distances with the powerful In-Beam detector (optional)
- Fully automated electron optics set-up and alignment
- Fast imaging rate up to 20 ns
- Unique live stereoscopic imaging by using the advanced 3D Beam Technology which opens up the micro and nanoworld for an amazing 3D experience and 3D navigation
Salient Features
Salient features
- Fully integrated TESCAN Essence™ EDS analysis platform for SEM imaging and real-time elemental analysis in the same window of Essence™ software;
- TESCAN’s unique non-aperture optical path design and real-time electron beam tracking technology (In-flight Beam Tracing™) can quickly obtain the best imaging and analysis conditions;
- Unique wide field optical path (Wide Field Optics™) design can achieve minimum magnification as low as 2 times, so the sample can be easily and accurately navigated without additional optical navigation camera;
- Standard SingleVac™ mode, non-conductive samples or electron beam sensitive samples can be directly observed in this mode without sputtering;
- Intuitive, modular Essence™ software for easy operation regardless of user experience level ;
- Essence™ 3D anti-collision model to ensure the safety of detectors installed in the sample chamber when the sample stage and sample are moved ;
- The optional SE and BSE detectors in the lens barrel and electron beam deceleration technology can better improve the imaging performance under low voltage ;
- Standard analysis platform, optionally integrated with the widest variety of detectors and accessories (such as cathode fluorescence detectors, water-cooled backscattered electron detectors , etc.) .
Common Applications
- Materials Science: Characterization of materials such as metals, ceramics, polymers, composites, coatings. Metallurgy, fracture analysis, degradation processes, ferromagnetic materials, etc.
- Semiconductor and Microelectronics: MEMS inspection, inspection of cross-sections and failure analysis in 3D-ICs and advanced packaging technologies, large wafer inspection, etc.
- Electro-technical Engineering: Solar cell inspection, microelectronics inspection, PN junction visualization,
lithography, etc.
- Forensic Investigations:
Gunshot residue analysis, bullet and cartridge investigation, tool mark comparison, analysis of hairs, fibres, textiles and papers, paints, ink and print characterization, line crossings, examination of counterfeit documents, etc. - Research:
Mineralogy, geology, palaeontology, archaeology, chemistry, environmental studies, particle analysis, applied physics, nanotechnology, nanoprototyping, etc.
- Life Sciences
Botany, parasitology, pharmaceutics, STEM histology, dental implants, etc.
User-Friendly Software
- Multi-user environment is localized in many languages
- Four levels of user expertise/rights, including an EasySEM™ mode for quick routine investigations
- Image management and report creation
- Built-in self-diagnostics for system readiness checks
- Network operations and remote access/diagnostics
- Modular software architecture enables several extensions to be attached
Services
Warranty: 02 (Two) years from the date of Successfully completion of Supply.