Orion Series Sputtering Systems
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Orion Series Sputtering Systems (manufactured by AJA International, Inc.) are compact, laboratory- and production-grade Physical Vapor Deposition (PVD) tools designed to deliver high-performance thin-film deposition in High Vacuum (HV) and Ultra-High Vacuum (UHV) regimes.
They are built as smaller, modular versions of AJA’s flagship ATC Series, making them popular in university research labs, nanotech facilities, and R&D centers.
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Description
Key Architecture & Core Features
1. Magnetron Sputtering Sources
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Target Sizes: Accommodates 2-inch and 3-inch target sources using AJA’s proprietary Stiletto (HV) and A300-XP (UHV) magnetron sources.
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Configurable Geometries: Supports con-focal (angled toward the center of the substrate), direct, and off-axis sputtering geometries.
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Capacity:
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Up to (8) 2-inch sputter sources.
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Up to (5) 3-inch sputter sources.
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Custom cluster flanges combining sputtering with thermal evaporation, ion sources, or in-situ analytics on a single flange.
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In-Situ Tilting: Allows precise control of target-to-substrate distance and incident angle.
2. Substrate Handling & Environmental Control
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Substrate Sizes: Accommodates samples ranging from small coupons up to 6-inch (150 mm) diameter wafers.
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Rotation & Uniformity: Uses motorized, continuous rotating substrate holders to ensure high film thickness uniformity and permit co-deposition of alloy/composite films.
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Temperature Range:
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Heating: Substrate heaters capable of reaching 800°C to 1,000°C for epitaxial growth and high-temperature annealing.
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Cooling: Water-cooled ($H_2O$) or Liquid Nitrogen ($LN_2$) cryogenic cooling stages.
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Substrate Biasing: Supports RF/DC substrate biasing for in-situ cleaning or controlling film stress and density during deposition.
3. Vacuum & Power Supply Configurations
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Vacuum Regimes: Available in High Vacuum (HV) or Ultra-High Vacuum (UHV, reaching base pressures down to $10^{-7}$ to $10^{-10}$ Torr). Load-lock options are available to speed up sample throughput without venting the main chamber.
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Power Supply Flexibility: Compatible with multiple power modes:
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DC Sputtering: Conductive metals (e.g., Au, Pt, Cu, Ti, Al).
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RF (Radio Frequency) Sputtering: Insulating and dielectric materials (e.g., $SiO_2$, $Al_2O_3$, $TiO_2$).
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Pulsed DC & HiPIMS: High-power impulse magnetron sputtering for dense, high-quality reactive films.
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Reactive Sputtering: Mass flow controllers (MFCs) supply gases such as $Ar$, $O_2$, and $N_2$ directly to local gas injection rings around targets or substrates to produce oxides and nitrides.
Primary Applications
| Field | Typical Use Cases |
| Spintronics & Magnetics | Multilayer heterostructures, magnetic thin films, and tunnel junctions requiring precise layer control. |
| Semiconductors & Optics | Dielectric coatings, metal interconnects, anti-reflective optical layers, and contact metallization. |
| Energy & Photovoltaics | Transparent Conductive Oxides (TCOs), thin-film solar cell materials, and solid-state electrolyte layers. |
| Materials Discovery | Co-deposition of binary/ternary alloys and combinatorial material gradients. |
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